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Material used = H-K9L
BK7-135 BK7 glass substrates, 20 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Quarter Wave Plate, Clear Aperture 10 mm, Dia 12.7mm
YSZ (double side epi-polished), <100>, 10 x 10 x 0.5 mm
High reflectivity mirror with hard dielectric coating (45° angle of incidence 532nm)
Calcium Fluoride Window, (90 mm Dia. x 15 mm Thick)
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.