BK7 glass substrates, 20 mm dia, 3 mm thick
: BK7-135 BK7 glass substrates, 20 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Properties
: Each substrate ultrasonically cleaned in high pH solution and de-ionised water
: ≥ 91.3% @ 400 nm, ≥ 91.8% @ 600 nm, ≥ 91.9% @ 800 nm
: Each substrate packed separately in cleanroom
Safety Information
Safety Information for this product is unavailable at this time.
| Packings | Price (INR) |
|
1 pc
|
12069.00
|
|
10 pc
|
86409.00
|
|
Custom size
|
POR
|