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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Plano Convex Spherical Lens, Focal Length : 100mm
Shearing Interferometers
7440-21-3
Silicon wafer (single side polished), <100>, N (Phosphorous doped), diam. x thickness 76 mm x 380 μm
Potassium Bromide Window (50mm Dia. x 3mm Thick)
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