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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Certificate Of Analysis
(For eg. B 1615-0108)
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Fused silica substrates, 25 mm dia, 1 mm thick
Half wave plate (Diameter: 12.7mm, Coating: AR/ AR, R<0.25%@532nm)
Plano Concave Spherical Lens, Dia 50.8 mm, Focal Length -250 mm
7440-21-3
Silicon wafer (single side polished), <100>, N-type, diam. x thickness 4 in x 0.525 mm
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