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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Zinc selenide optical windows, 125 mm dia. x 15 mm thick
7440-21-3
Silicon wafer (single side polished), <100>, diam. × thickness 50.8 mm × 0.3 mm
Plano Convex Lens, Dia 50.8 mm, Focal Length 200 mm
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 250mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.