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Material used = H-K9L
BK7-144 BK7 glass substrates, 25 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Dielectric coated beam splitter (Multi-layer) 1050-1070 nm
Zinc selenide optical windows, 125 mm dia. x 15 mm thick
Barium fluoride window diam. x thick 32 mm x 3 mm
Right angle prism, 25 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.