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Certificate of Analysis

BK7 glass substrates, 25 mm dia, 3 mm thick

Code: BK7-144

(For eg. B 1615-0108)

Material used = H-K9L

BK7-144 BK7 glass substrates, 25 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.