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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 0243 (OTTO) Silicon sputtering target, diam. × thickness 50 mm × 6 mm, 99.99% - used for the production of the silicon, sputtering is widely used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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7440-74-6
Indium sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
Hastealloy X
Hastelloy C276 wire, diam 1.0 mm, 99.9%
409-21-2
Silicone carbide 220 mesh
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.