Boron sputtering target, diam. x thickness 30 mm × 10 mm, ≥99.9%

Description

Boron Sputtering Target enables the deposition of thin films with outstanding hardness, chemical stability, and thermal resistance, leveraging boron’s strong covalent bonding and low atomic mass. These targets allow for precise control over film stoichiometry, enabling coatings with desirable mechanical, optical, and electronic properties. Industries such as semiconductor fabrication, tribology, and energy systems utilize boron sputtering to produce high-performance protective coatings, dielectric layers, and thermoelectric interfaces. Specific applications include hard coatings for cutting tools, barrier layers in microelectronics, and functional films for energy conversion devices. Research has advanced deposition techniques such as pulsed magnetron sputtering to improve coating uniformity, adhesion, and phase control, opening pathways for new applications in nanostructured materials and multifunctional surfaces. The boron sputtering target’s ability to deliver tailored, high-performance films underpins its importance in driving forward both industrial coating technologies and materials research.

Application

B 7063 (OTTO) Boron sputtering target, diam. x thickness 30 mm × 10 mm, ≥99.9% Cas 7440-42-8 - used in chemical compounds.