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Material used = H-K9L
BK7-135 BK7 glass substrates, 20 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Laser Line Non-Polarizing Beam Splitter plate (R=50%) @ 532nm
Plano Convex Lens, Dia 50 mm, Focal Length 80 mm
7440-21-3
Silicon optical (mono crystalline) windows, 30 mm dia, 15 mm thick, 99.999%
Potassium bromide window (uncoated) 40 mm dia x 3 mm thickness
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.