can't read?
Material used = H-K9L
BK7-144 BK7 glass substrates, 25 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
Zero Order Quarter Wave Retardation Plate, Dia 25 mm, Thick 6 mm
SOI wafers, 6 Inch, Dia 150 mm, P-type, Boron Doped
Cerium doped YAG (Ce:YAG) single crystal, Dia 50 mm, thick 0.5 mm
Plano convex lens, dia 25.4 mm, focal length 15 cm
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.