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BK7 glass substrates, 25 mm dia, 3 mm thick

Code: BK7-144
9001

Container
18%
9001


Container

18%
PackingsPrice (INR)
1 pc 12069.00
10 pc 86409.00
Packings
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Properties
25 mm

± 5%

3 mm

± 5%

40-20 or better

Uncoated

≤ 3 arc minute

Better than λ/ 4

Each substrate ultrasonically cleaned in high pH solution and de-ionised water

≥ 91.3% @ 400 nm, ≥ 91.8% @ 600 nm, ≥ 91.9% @ 800 nm

Each substrate packed separately in cleanroom

Description

Material used = H-K9L

Application

BK7-144 BK7 glass substrates, 25 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.

Safety Information

Safety Information for this product is unavailable at this time.

Documentation

Certificate Of Analysis

(For eg. B 1615-0108)

Other Documents

For any quries, please write to us at

qc@ottokemi.com
Technical Services

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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received.
Not for medical, household or any other uses, for lab use only, Please test before use.


PackingsPrice (INR)
1 pc 12069.00
10 pc 86409.00