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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 6091 (OTTO) Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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1303-00-0
Gallium arsenide wafers, N-TYPE, dia 76.2 mm, thick 500 µm, <100>
Plano silver mirror, Dia 25 mm, Thick 6 mm
Plano Convex Spherical Lens, Dia 38.1mm, Focal Length 50mm, AR @ 532 nm
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 500mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.