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Laser substrases. Most of the applications of fused silica exploit its wide transparency range, which extends from the UV to the near IR. Fused silica is the key starting material for optical fiber, used for telecommunications.
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Certificate Of Analysis
(For eg. B 1615-0108)
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Half Wave Plate, Clear Aperture 10 mm, Dia 12.7mm
SI wafers, P-type, dia 4 inch, thick 0.525 mm [Thermal oxide wafer 300 nm SiO2 layer on Si (100)]
Plano Convex Lens, Dia 25 mm, Focal Length 75 mm
Glass wafers, diam. × thickness 2 in × 300 μm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.