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Kindly note: Due to ongoing raw material / metal shortages and market price volatility, all orders including those placed online will be subject to reconfirmation by our sales team, including revised pricing and delivery dates. We appreciate your understanding.
Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 5716 (OTTO) Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99% - used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
12068-69-8
Bismuth selenide doped with copper, sputtering target, diam. × thickness 1 inch × 3 mm, 99.95% (5 wt% Cu)
Poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) dry re-dispersible pellets
7440-21-3
Silicon wafer (single substrase), <100>, n-type, contains Arsenic as dopant, diam. × thickness 4 in. × 0.2 mm
Copper tin alloy, Cu85Sn15
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.