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Kindly note: Due to ongoing raw material / metal shortages and market price volatility, all orders including those placed online will be subject to reconfirmation by our sales team, including revised pricing and delivery dates. We appreciate your understanding.
Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 5716 (OTTO) Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99% - used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
37275-76-6
Aluminium zinc oxide sputtering target, diam. × thickness 50.8 mm × 3 mm
7439-94-3
Lutetium sputtering target, diam. x thickness 55 mm × 3 mm, 99.9%
1314-61-0
Tantalum pentoxide sputtering target, diam. x thickness 304.8 mm x 10 mm, 99.99% elastomer bonding to Copper backing plate 304.8mm dia x 16 mm thick
12537-81-4
Titanium aluminium carbide 211, ≥80%, ≤40 μm particle size
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.