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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 5716 (OTTO) Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99% - used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
7440-02-0
Nickel sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
50926-11-9
Indium tin oxide coated glass slide, rectangular (surface resistivity 70-100 Ω/sq, slide)
5970-45-6
Zinc acetate dihydrate ACS reagent, ≥98%
Stainless steel - AISI 304 rod, Fe/Cr18%/Ni 10%, 120 mm dia, length 1000 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.