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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Silicon wafer, <100>, p-type, contains Boron (B) as dopant, diam. x thickness 150 mm x 320 μm
Co76Si14B10 alloy sputtering target dia x thickness 2 inch × 1.5 mm, ≥99.9%
Ni80Cr20 sputtering target 99.95% 3 inch dia x 2 mm thick
1309-48-4
Magnesium oxide (single crystal substrate), ≥99.9% trace metals basis, <100>, L × W × thickness 10 mm × 10 mm × 0.5 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.