can't read?
Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 3155 (OTTO) Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999% - used for the production of the silicon, sputtering is widely used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
7440-36-0
Antimony sputtering target, diam. × thickness 2 inch × 0.125 inch, 99.999%, with bonded Copper (Cu) backing plate of thickness 3 mm
12018-93-8
Holmium Copper alloy
8049-11-4
Devardas alloy
Ruthenium sputtering target dia x thickness 2 inch × 1 mm, ≥99.9%
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.