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Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999%

Code: S 3155

Si

28046900

28.09

Bottle / Drum
18%

Si

28046900

28.09

Bottle / Drum

18%
PackingsPrice (INR)
1 pc POR
10 pc POR
100 pc POR
Packings
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Properties
99.999%

Solid

2 inch

± 5%

3 mm

± 1%

Description

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

Application

S 3155 (OTTO) Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999% - used for the production of the silicon, sputtering is widely used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).

Safety Information

WGK Germany 2

Documentation

Certificate Of Analysis

(For eg. B 1615-0108)

Other Documents

For any quries, please write to us at

qc@ottokemi.com
Technical Services

Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.

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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received.
Not for medical, household or any other uses, for lab use only, Please test before use.


PackingsPrice (INR)
1 pc POR
10 pc POR
100 pc POR