Technical data sheet (TDS) / Specifications sheet

Tungsten disilicide sputtering target, diam. x thickness 3 inch x 3 mm, with indium bonded 0.2 mm copper backing plate thickness 2 mm, 99.9%

: T 0873

: WSi2

: 240.02

: Tungsten Disilicide (WSi2) Powder is an inorganic and conductive ceramic compound with a high melting point and excellent oxidation resistance.

: T 0873 (OTTOKEMI) Tungsten disilicide sputtering target, diam. x thickness 3 inch x 3 mm, with indium bonded 0.2 mm copper backing plate thickness 2 mm, 99.9% Cas 12039-88-2 - used in chemical research.


Properties

: 99.9%

: Solid

: 3 inch

: 3 mm

: ± 1%

:

: 3 inch

: 2 mm

: ± 1%

: Indium

: 99.99%

: 0.2 mm


Safety Information

WGK 1


PackingsPrice (INR)
1 pc POR