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Silicon wafers / substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 180 - Silicon wafer (single side polished), <100>, N (Phosphorous doped), diam. x thickness 50.8 mm x 280 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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7440-21-3
Silicon substrate, single side polished, <111>, P-type, contains boron as dopant, diam. × thickness 50 mm × 1 mm
Round Ultrabroadband Dielectric Mirrors
Zero-order Waveplates, Dia 10 mm, Wavelength (λ) 575 nm
Fused silica optical window, 177 mm dia, 10 mm thick
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.