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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Dielectric coated HR mirrors (Multi-layer) 400nm
7440-21-3
Silicon wafer, <100>, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm
SI wafers, P-type, dia 4 inch, thick 0.525 mm [Thermal oxide wafer 300 nm SiO2 layer on Si (100)]
Half wave plate (Diameter: 12.7mm, Coating: AR/ AR, R<0.25%@532nm)
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.