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Copper is a chemical element with symbol Cu. It is a soft, malleable and ductile metal with very high thermal and electrical conductivity.
C 1051 (OTTO) Copper sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99% - used mostly as a pure metal, but when greater hardness is required
RIDADR UN 3077 9 / PGIII
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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7440-25-7
Tantalum, sputtering target, diam. x thickness 1 inch x 0.125 inch, 99.95%
12068-69-8
Bismuth selenide doped with copper, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95% (5 wt% Cu)
7440-21-3
Silicon wafer (single substrase), <100>, p-type, contains Boron (B) as dopant, diam. x thickness 100 mm x 0.525 mm
112-55-0
1-Dodecanethiol, 98%
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.