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Material used = H-K9L
BK7-090 BK7 glass substrates, 50.8 mm dia, 1 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 30mm, AR @ 940 nm
Platinized silicon wafer, dia 100 mm, thick 350-500 μm
7440-21-3
Silicon substrate, single side polished, <100>, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm
Mounted AR Coated Aspheric Lens (f = 50 mm)
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.