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Material used = H-K9L
BK7-090 BK7 glass substrates, 50.8 mm dia, 1 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Potassium Bromide Window, (42mm Dia. x 2mm Thick)
7440-21-3
Silicon wafer, both side polished, <100>, N-type, single crystal, dia x thickness 3 in x 500 μm
Silicon wafer (single side polished), <100>, N (Phosphorous doped), diam. x thickness 76 mm x 380 μm
LBO crystals, Frequency conversion (SHG OF 1064nm TO 532nm in Y-Z plane)
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