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Material used = H-K9L
BK7-090 BK7 glass substrates, 50.8 mm dia, 1 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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7440-21-3
Silicon wafer, single side polished, <100>, P-type, diam. x thickness 1 in. x 300-400 μm
Fused silica wafers dia 100 mm thick 1 mm
Nd YLF laser rod (1%, a-cut, dia7*125mm, AR/AR@1053nm)
Zero-order Waveplates, Dia 10 mm, Wavelength (λ) 595 nm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.