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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SW 135 (OTTO) Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 100 mm x 500 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Plane optical window, 150 mm dia, 8 mm thick
Barium fluoride window diam. x thick 8 mm x 1.5 mm
7440-21-3
Silicon wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm
Nd:YAG Laser Rods, Doping Concentration 0.4 at%
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.