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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 561 (OTTO) Silicon wafer (single side polished), <111>, N-type, contains phosphorus as dopant, diam. x thickness 2 in. x 0.275 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Plano Convex Cylindrical Lens, Focal Length : 100mm
Dielectric coated beam splitter (Multi-layer) 1050-1070 nm
Fused silica substrates, 25 mm dia, 1 mm thick
Half Wave Plate, Clear Aperture 10 mm, Dia 12.7mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.