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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 570 - Silicon wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. x 0.5 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Potassium Bromide Window, (90mm Dia. x 15mm Thick)
7440-21-3
Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 150 mm x 625 µm
Plano Convex Lens, Dia 25 mm, Focal Length 75 mm
Plano convex lens, dia 25.4 mm, focal length 25 cm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.