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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 570 - Silicon wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. x 0.5 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Plano convex lens, dia 50.8 mm, focal length 15 cm
Laser Grade Plano Convex Lens, Dia 50 mm, Focal Length : 200 mm
Zero-order Waveplates, Dia 10 mm, Wavelength (λ) 595 nm
22398-80-7
Indium phosphide substrates, <100>, semi insulating, contains iron as dopant, diam. × thickness 50.5 mm × 350 μm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.