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Certificate of Analysis

Silicon wafer (single side polished), <100>, N-type, contains phosphorus as dopant, diam. x thickness 2 in. x 0.5 mm

Code: SSC 570

(For eg. B 1615-0108)

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

SSC 570 - Silicon wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. x 0.5 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.