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Laser substrases. Most of the applications of fused silica exploit its wide transparency range, which extends from the UV to the near IR. Fused silica is the key starting material for optical fiber, used for telecommunications.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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7440-21-3
Silicon wafer, <100>, dia x thickness 25.4 mm x 0.5 mm
Band pass filter, 532 nm, 12.5 mm
Silicon wafer (single side polished), <100>, N-type, diam. x thickness 4 in x 0.525 mm
Half wave plate (Diameter: 12.7mm, Coating: AR/ AR, R<0.25%@808nm)
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.