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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Aluminium optical mirrors (Round UV enhanced protected)
7440-21-3
Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 150 mm x 625 µm
Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm
Dielectric Coated Mirror, Width 80 mm x Height 120 mm, Thickness: 10 mm
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