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Silicon wafer, both side polished, <100>, N-type, single crystal, dia x thickness 2 in x 280 μm

Code: S 8687

Synonyms: Silicon substrate, single crystal, dia x thickness 2 in x 280 μm


PRIME-CZ

Si

9002

Double side polished

28.09

Bottle / Drum
18%

PRIME-CZ

Si

9002

Double side polished

28.09

Bottle / Drum

18%
PackingsPrice (INR)
1 pc 24039.00
10 pc POR
Custom size POR
Packings
Enquire
Properties
2 inch

± 0.1%

280 μm

± 0.1%

Double side polished

N-type

(100)

± 0.5°

1.25 - 2.50 Ohm-cm

Description

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

Application

S 8687 (OTTO) Silicon wafer, both side polished, <100>, N-type, single crystal, dia x thickness 2 in x 280 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.

Safety Information

WGK Germany 2

Documentation

Certificate Of Analysis

(For eg. B 1615-0108)

Other Documents

For any quries, please write to us at

qc@ottokemi.com
Technical Services

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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received.
Not for medical, household or any other uses, for lab use only, Please test before use.


PackingsPrice (INR)
1 pc 24039.00
10 pc POR
Custom size POR