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Specification Sheet

Silicon wafer, both side polished, <100>, N-type, single crystal, dia x thickness 2 in x 280 μm

: Silicon substrate, single crystal, dia x thickness 2 in x 280 μm

: S 8687

: PRIME-CZ

: Si

: Double side polished

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: S 8687 (OTTO) Silicon wafer, both side polished, <100>, N-type, single crystal, dia x thickness 2 in x 280 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.


Properties

: 2 inch

: ± 0.1%

: 280 μm

: ± 0.1%

: Double side polished

: N-type

: (100)

: ± 0.5°

: 1.25 - 2.50 Ohm-cm


Safety Information

WGK Germany 2


PackingsPrice (INR)
1 pc 24039.00
10 pc POR
Custom size POR