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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 50mm
Plano Convex Spherical Lens, Dia 50.8mm, Focal Length 100mm
22398-80-7
Indium phosphide (single crystal substrate), (100) ± 0.5o
Dielectric Coated Mirror, Dia 25 mm
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