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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Plano Convex Spherical Lens, Dia 38.1mm, Focal Length 50mm, AR @ 532 nm
Potassium Bromide Window (25mm Dia. x 4mm Thick)
Laser Grade Plano Convex Lens, 38.1 mm Dia, Focal Length : 127 mm
Laser Line Clean-Up Filters, Wavelength 532 nm
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