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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Plano convex lens, dia 50.8 mm, focal length 7.5 cm
Plano convex lens, dia 25.4 mm, focal length 3 cm
7440-21-3
Silicon substrate, single side polished, <111>, P-type, contains boron as dopant, diam. × thickness 50 mm × 1 mm
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 30mm, AR @ 532 nm
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