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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Plano Convex Lens, Dia 10 mm, Focal Length 25 mm
Laser Line Clean-Up Filters, Wavelength 532 nm
BK7 glass substrates, 25 mm dia , 1 mm thick
1303-00-0
Gallium arsenide wafers, <100>, diam. × thickness 76.2 mm × 625 mm
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