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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 076 - Silicon wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. x 0.5 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Glass Wafers (100 mm x 100 mm x 0.2 mm)
Plane optical window, 150 mm dia, 8 mm thick
Plano Convex Lens, Dia 25 mm, Focal Length 100 mm
Zero Order Quarter Wave Retardation Plate, Dia 25 mm, Thick 6 mm
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.