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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 6003 (OTTO) Silicon wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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BK7 glass substrates, 50.8 mm dia, 1 mm thick
Nd:YAG laser mirror, dia 50 mm, thick 5 mm
Quartz substrates (Dimension: ~ 3” × 1” × 1.1 mm)
Round Ultrabroadband Dielectric Mirrors
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.