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: S 6003
: 7440-21-3
: PRIME
: Si
: Double side polished
: 28.09
: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
: S 6003 (OTTO) Silicon wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
: Crystal optics,Chemically coated windows / substrates
: 2 inch
: ± 1%
: 250 μm
: P-type
: (111)
: ± 0.5°
: 1-5 ohm.cm or less
: Boron as dopant
: Less than equal to 60 µm
: < 5Å
WGK Germany 2