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Specification Sheet

Silicon wafer, <100>, p-type, contains Boron (B) as dopant, diam. x thickness 150 mm x 320 μm

: SSW 108

: PRIME

: Single crystal sapphire has a unique combination of physical, chemical and optical properties allowing it to withstand high temperatures, high pressure, thermal shock, and water or sand erosion

: SSW 108 (OTTO) Silicon wafer, <100>, p-type, contains Boron (B) as dopant, diam. x thickness 150 mm x 320 μm - used for hybrid microelectronic applications requiring a uniform dielectric constant and highly insulating characteristics, photoelectronic applications, including the high brightness LED market.


Properties

: Silicon high purity

: <100>

: ± 0.5°

: 150 mm

: ± 0.2 mm

: 320 μm (0.320 mm)

: ± 15 μm

: Boron as dopant

: p-Type

: 5000-9000 Ωcm

: Front side miror polished, No secondary flat

: {110} ± 1 ° as per SEMI standard

: 10 μm

: 30 μm

: 57.5 ± 2.5 mm

: FZ

: None


Safety Information

WGK Germany 2
RTECS VW0400000


PackingsPrice (INR)
1 pc POR
10 pc POR
Custom size POR