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: Silicon wafer (single side polished) <100>, P-type, diam. x thickness 1 in. x 300-400 μm
: S 8044
: 7440-21-3
: Si
: 28.09
: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
: S 8044 (OTTO) Silicon wafer, single side polished, <100>, N-type, diam. x thickness 1 in. x 300-400 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
: Crystal optics,Chemically coated windows / substrates
: 1 inch
: 300- 400 μm
: ± 5%
: Single side polished
: N type
: <100>
: ± 0.5°
: 1-10 ohm cm
: RA <5 A
WGK Germany 2