Specification Sheet

Platinized silicon wafer, dia 4 inch mm, thick 300-600 μm

Code

: PSW009

Grade

: prime grade Si wafer

Description

: Platinized silicon wafers are commonly used as substrates.

Applications

: PSW009 (OTTO) Platinized silicon wafer, dia 4 inch mm, thick 300-600 μm - used as substrates.

Categories

Shape of the wafer

: Circular

Polish

: Double / Single sided

Orientation of Silicon

: <100>

Orientation of Platinum

: <111>

hickness of Silicon Wafer

: 300-600 μm

Diameter

: 4 inch

Resistivity

: 1- 20 ohms-cm

Tolerances

: +/-0.1mm

Thickness of Platinum

: 0.2 microns (2000A)

Oxide layer thickness

: 5000 A ° + 200 A°

TiO2 buffer layer thickness

: 400 A° to 450 A°

Roughness

: < 5 nm

Temperature stability of Pt layer

: Pt layer should not peel of up to a temperature of 600°C to 650°C

Safety Information for this product is unavailable at this time.

Packings	Price (INR)
1 pc	169029.00

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