Enquiry

Specification Sheet

Fused silica substrates, 25 mm dia, 3 mm thick

: FS 108

: FS 108 (OTTO) Fused silica substrates, 25 mm dia, 3 mm thick - used for telecommunications.


Properties

: 312 / 7980

: 25 mm

: ±0.2 mm

: 3

: ±0.1 mm

: ≤3.0 arc min

: 40/20

: ≤ λ/4

: 0.25 mm × 45 degrees on both sides

: ≦0.03 mm2

: Free

: ≦ 4 ppm

: ≤ 5 nm/cm

: ≤ 1000 ppm (μg/g)


Safety Information

Safety Information for this product is unavailable at this time.


PackingsPrice (INR)
1 pc POR
10 pc POR
1000 pcs POR