9820041841
Technical data sheet (TDS) / Specifications sheet
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Silicon sputtering target, diam. x thickness 3 inch x 3 mm, with indium bonded 0.2 mm copper backing plate thickness 2 mm, 99.99%

: S 4621

: 7440-21-3

: Si

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: S 4621 (OTTOKEMI) Silicon sputtering target, diam. x thickness 3 inch x 3 mm, with indium bonded 0.2 mm copper backing plate thickness 2 mm, 99.99% - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.

Properties

: Metals,Silicon

: 99.99%

: Solid

: 3 inch

: 3 mm

: ± 1%

:

: 3 inch

: 2 mm

: ± 1%

: Indium

: 99.99%

: 0.2 mm

Safety Information

WGK Germany 2

PackingsPrice (INR)
1 pc POR
10 pc POR
Custom size POR
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