: S 5770
: 7440-21-3
: PRIME
: Si
: Double side polished
: 28.09
: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
: S 5770 (OTTO) Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
: Crystal optics,Chemically coated windows / substrates
: 100 mm
: ± 0.5 mm
: 250 μm
: ± 20 μm
: Single side polished
: P-type
: <100>
: ± 0.5°
: Boron as dopant
: 1-10 ohm.cm or better
WGK Germany 2