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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SIW081 (OTTOKEMI) Silicon wafer (single side polished), <100>, P-type, diam. x thickness 2 in x 285 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells
RIDADR NONH for all modes of transport
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Nickel-boron master alloy (Ni: 83-85% and B: 14-16%) irregular particles, <15 mm, 99.9%
Sapphire substrates, <0001>, L × W × thickness 10 mm × 10 mm × 0.5 mm
409-21-2
Silicone carbide 220 mesh
137829-79-9
Pyrromethene 597
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.