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Silicon wafers or substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SIW072 (OTTOKEMI) Silicon wafer (single side polished), <111>, P-type, diam. x thickness 2 in x 285 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
RIDADR NONH for all modes of transport
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Carbon felt, 3.18mm thick, 99%
7439-89-6
Iron sputtering target, diam. x thickness 50 mm x 6 mm, 99.99%
7440-21-3
Silicon wafer (single substrase), <100>, n-type, contains Phosphorus as dopant, diam. × thickness 2 inch x 0.3 mm
7440-25-7
Tantalum, sputtering target, diam. x thickness 1 inch x 0.125 inch, 99.95%
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.