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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Certificate Of Analysis
(For eg. B 1615-0108)
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Silicon optical (mono crystalline) windows, 30 mm dia, 15 mm thick, 99.999%
Zero-order Waveplates, Dia 10 mm, Wavelength (λ) 575 nm
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 250mm
Quartz substrate, thickness 1.0 mm, size 10 × 10 mm
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