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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SS 405 (OTTO) Silicon substrate (single side polished), <100>, P-type, diam. × thickness 1 in. × 300 - 400 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Plano Concave Spherical Lens, Dia 50.8 mm, Focal Length -200 mm
Dielectric Beam Splitter, dia 100 mm, thick 15 mm
Potassium Bromide Window (25mm Dia. x 4mm Thick)
Cerium doped YAG (Ce:YAG) single crystal, Dia 50 mm, thick 0.5 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.