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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SIW081 (OTTOKEMI) Silicon wafer (single side polished), <100>, P-type, diam. x thickness 2 in x 285 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells
RIDADR NONH for all modes of transport
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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CrSi 91.1/8.9at% target, 50.8 mm dia. x 5 mm thick, 99.9% (Indium bonded to 1 mm thick copper backing plate)
Magnesium oxide sputtering target dia x thickness 2 inch × 2 mm, ≥99.9%
7782-42-5
Graphite nanofibers, 200-500 nm
Stainless steel - AISI 304 rod, Fe/Cr18%/Ni 10%, 40 mm dia, length 1500 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.