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FS 090 Fused silica substrates 25.4 mm dia, 1 mm thick - used for telecommunications.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Right angle prism, 15 mm
Plano Concave Spherical Lens, Dia 50.8 mm, Focal Length -300 mm
7440-21-3
Silicon wafer (single side polished), <111>, P-type, contains boron as dopant, diam. x thickness 2 in. x 0.5 mm
BK7 glass substrates, 25 mm dia, 3 mm thick
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.