Certificate of Analysis

Tungsten disilicide sputtering target, diam. x thickness 3 inch x 3 mm, with indium bonded 0.2 mm copper backing plate thickness 2 mm, 99.9%

Code: T 0873

(For eg. B 1615-0108)

Description

Tungsten Disilicide (WSi2) Powder is an inorganic and conductive ceramic compound with a high melting point and excellent oxidation resistance.

Application

T 0873 (OTTOKEMI) Tungsten disilicide sputtering target, diam. x thickness 3 inch x 3 mm, with indium bonded 0.2 mm copper backing plate thickness 2 mm, 99.9% Cas 12039-88-2 - used in chemical research.