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Certificate of Analysis

Silicon wafer, single side polished, <100>, N-type, diam. x thickness 1 in. x 300-400 μm

Code: S 8044

(For eg. B 1615-0108)

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

S 8044 (OTTO) Silicon wafer, single side polished, <100>, N-type, diam. x thickness 1 in. x 300-400 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.