Silicon sputtering target, diam. x thickness 3 inch x 3 mm, with indium bonded 0.2 mm copper backing plate thickness 2 mm, 99.99%

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

S 4621 (OTTOKEMI) Silicon sputtering target, diam. x thickness 3 inch x 3 mm, with indium bonded 0.2 mm copper backing plate thickness 2 mm, 99.99% - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.