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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 7659 (OTTO) Silicon wafer, <100>, P/N-type semi insulating, diam. × thickness 3 in x 500-600 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Silicon wafer (single side polished), <111>, P-type, contains boron as dopant, diam. x thickness 2 in. x 0.5 mm
Sapphire single crystal wafer, C-plane <0001>, dia. x thickness 100 mm x 1 mm
Plano Convex Lens, Dia 25.4 mm, Focal Length 300 mm
Nd:YAG Laser Rods [Doping Concentration 1.1 % Doping of Nd +3]
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.