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Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 150 mm x 625 µm

Code: SW 108

Si

9002

28.09

Bottle / Drum
18%

Si

9002

28.09

Bottle / Drum

18%
PackingsPrice (INR)
1 pc POR
10 pc POR
100 pcs POR
Packings
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Properties
150 mm

± 5%

625 μm

± 5%

<100>

± 0.5°

Intrinsic

Double side polished

>10000 Ω-cm

Description

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

Application

SW 108 (OTTO) Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 150 mm x 625 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.

Safety Information

WGK Germany 2

Documentation

Certificate Of Analysis

(For eg. B 1615-0108)

Other Documents

For any quries, please write to us at

qc@ottokemi.com
Technical Services

Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.

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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received.
Not for medical, household or any other uses, for lab use only, Please test before use.


PackingsPrice (INR)
1 pc POR
10 pc POR
100 pcs POR