can't read?
Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SS 360 (OTTO) Silicon substrate (single side polished), <100>, P-type, diam. × thickness 1 in. × 300 - 400 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
1303-00-0
Gallium arsenide (GaAs substrate), <100>, (undoped, 10 x 10 x 0.5 mm)
Dielectric coated beam splitter (Multi-layer) 400 nm
ZnSe Optical Windows, (32 mm Dia. x 3 mm Thick)
7440-21-3
Silicon optical, mono crystalline, windows, 90 mm dia, 10 mm thick, 99.999%
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.